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The AP1 solder nozzle system offers the most flexible of all of the selective soldering processes they are available. This applicator is able to solder single components and/or rows of pins in X & Y axes and diagonally.
The jetwave nozzle has been introduced to increase throughput and is especially effective when soldering connectors and components with longer legs.
The single dip process has been developed to meet the ever increasing need for high speed and high volume pcb production.