JADE
For users who demand a small footprint but large board capability the new JadeMKII is the perfect fit. by incorporating a board support system that can hold a PCB of up to 457mm x 508mm (18"x20") along with its simple hand load operation provides the user with great flexibility for quick changes in small batch processing which keeps the cost down and the production up.
Jade Features
- Integral PC and Machine Mounted TFT Monitor
- Inerted Nitrogen System
- Auto Solder Top-up (Wire Feed) & Solder Level Detect
- Drop Jet Fluxer
- Two AP-1 Solder Nozzle Tips
- Internal Fume Extraction
- Colour Programming Camera
- Universally Adjustable Tooling Carrier
- 457mm x 508mm Maximum PCB Handling Size
- PillarCOMM Windows Software
- Lead Free Capability
Jade Options
- Fail-proof Solder Pot & Reel Identification Coding (Not Yet Available)
- X, Y & Z Axis Encoders (Not Yet Available)
- Selective Pre-Heat
- Top Side IR Pre-Heat
- Closed Loop Thermocouple Top-Side Pre-Heat Control System
- Closed Loop Pyrometer Top-Side Pre-Heat Control (Available from 1st August 2010)
- Manual Fiducial Correction System
- Auto Fiducial Recognition and Correction System
- Solder Wave Height Measurement
- PCB Warp Correction System (Not Yet Available)
- Pump RPM Monitoring (Not Yet Available)
- Process Viewing Camera
- Multilevel Password Security System
- Additional Interchangeable Solder Bath & Pump System
- Flux Level Sensor
- Dual Flux Bottle Assembly
- Additional Drop-Jet Flux Head
- Sonotek Ultrasonic Fluxer in lieu of Drop-Jet
- Twin Sonotek Ultrasonic Fluxing Configuration in lieu of Single Drop Jet (will reduce PCB Handling Size)
- Light Stack Tower
- PillarPad Offline Programming Package
End FAQ
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