In many cases after a conventional reflow process where the PCB is heated, warpage can take place after this process.

This can create significant problems for the subsequent selective soldering operation in the form of missed solder joints, and other associated process problems.

In the absence of any alternative corrective process the traditional method to overcome this problem has been to introduce a costly palletised approach or by other methods of supporting the product during the selective soldering process.

Pillarhouse are now offering an option that allows measurement and correction for height variations of the PCB by means of a laser displacement sensor. The board warp coordinates are freely programmable by the operator and will allow height vectoring for solder draw paths.

This system provides a cost effective and repeatable production solution without the need for any form of product support or strengthening.